If I were to choose from a well executed raster image logo in the marking and a badly burned vector one, I’d opt for the latter in a heartbeat. I’ve explained the reason and would not repeat here.
For the hFE, you need to know the Ic and Vce your testing was performed at, in order to make a meaningful comparison with the numbers in the datasheet. If you don’t know, measure them.
The datasheet says minimum hFE is 170 at 25 degree C, Ic=-1ma and Vce=-5V. From the chart you can see hFE goes slightly up from Ic=-1ma to -10ma and then to -20ma before it starts to drop after Ic=100ma (the red line). If your sample tests at hFE=150 between Ic=-1ma and -10ma, it’s below spec and would be a reject by the factory.
You can see the red line is well above 200 and approaching the 300 line, so 340 is not a surprise. +/-20% is considered normal variation.
Why would they specify min hFE at only 120 at Ic=-20ma? It could be a simple mistake, or indicating that the hFE could drop as early as Ic=-20ma, unlike what the typical curve suggests, which is a bad news for circuit designers (not applicable for our applications). Nevertheless, sandbagging would not get them into trouble anyways, if you know what I mean.
I could go on and on and brag about my affiliation with the semiconductor industry, but let’s keep the personal information out of this discussion. If you think my comments make sense, think about it. Otherwise, just take it with a grain of salt.