I'm affraid you're making the wrong conclusion here buddy!
why keep your findings to yourself? why not contact Mr. Colloms and explain your findings? truely, he will be nothing but interested in fine tuning his rating system.
Talking to a few people on the forums won't change much. Probably better to forget all about this forum stuff and focus on the magazines rather - think of how many people reading those, being misinformed, mislead and so forth ...you're actually in a position to help the magazines and lead the way ...
Cool. In that case, eutectic solder has the lowest melting point, so 370 and 430C are too high. Try cranking the temp down, applying heat for less time, and using less solder and see if your joints look better. Hopefully that means when you solder the new terminal block you won't be leaking that flux residue to the feedback trace again. You really want the lowest temperature that can still work, because higher temperatures mean shorter tip and heating element life, burnt flux, more thermal stress on the components and pads, etc. Also, I don't know what flux you are using, but make sure if it is rosin activated/corrosive that you clean all of it off everywhere you can. I use standard Kester 44, which has somewhat alarmingly strong claims to contain no-clean activated rosin core:
For extreme overkill, you can also use a terminal block with more isolated pins like JoaMat posted or put the block in from the other side if possible, but I'd play around with soldering technique a bit more first because it's just good practice.